Bd0o7YylHJUALstBbDDdfPH4z74

BGA rework
system
1.Three independent heater
2.Hot air and IR heating
3.Flexible design
Features
1.With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;
2.Upper and bottom heater with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve;
Upper, bottom heater and infrared start heating at the same time;
3.Three heating zone with independent PID to control heating process, more stable and accurate.
4.Bottom heater and IR preheating zone with supporter to prevent PCB part deformation;
5.After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering;
6. Equipped with a variety size of hot-air nozzle, or made according to special requirements;
7.Build-in vacuum pump, no need gas source.
8.warranty 5 months(heaters and pc410 not covered)
Specifications
| PCB size | ≤L540×W450mm |
| PCB Thickness | 0.1~5mm |
| Temperature control | K Thermocouple, Closed loop |
| PCB Positioning | Outer |
| Sub (Bottom) heater | Infrared 2400W |
| Main (Top+bottom) heater | Hot air 800W+800W |
| Power supply | Single phase 220V,50/60Hz,4.0KVA |
| Machine dimension | L700*W515*H550mm |
| Weight of machine |
Approx. 37kgs |
call 9844532392 for complete BGA REWORK SYSTEM package